Design and fabrication of innovative 3D flexible circuits and systems
Circuits and systems requires no static power dissipation, wide noise margins, and high operational performance stability. In silicon-based integrated circuits, these requirements were achieved by using complementary (both p- and n-type) transistors. The same approach was adopted for the implementation of organic complementary circuits. We have adopted the 3D integration of complementary organic field-effect transistors (OFETs) to overcome the physical limits of the conventional 2D integration. Based on this 3D integration, we are fabricating various organic circuits with high transistor density. Also, we are focusing on the development of robust and predictable fabrication process of flexible organic integrated circuits based on inkjet printing technique that is applicable to low cost roll-to-roll process.